QA/FA/Rel Forum
Replies
Author
Views
Last Post
PPM Calculation
1
Guest
765
Sun Apr 10, 2026 1:59 am QA 4ever
Lead Free of BGA devices
0
guest
649
Tue Apr 05, 2026 4:04 pm guest
different mold and laser markings
1
STP
614
Fri Apr 01, 2026 4:28 pm Guest
D6000 Sonoscan For Sale
0
Guest
616
Wed Mar 30, 2026 3:40 pm Guest
Burnt
3
PCBA FA Eng
872
Mon Mar 28, 2026 10:39 am Guest who
Board Level Lead Free Solder Profile
1
Rel Boy
644
Fri Mar 25, 2026 10:07 pmFARel Engr
Voltage or Temperature Testing for Screening purpose
3
Guest
825
Tue Mar 22, 2026 9:43 amEE
Resistance increase
0
PCBA FA Eng
639
Mon Mar 21, 2026 11:23 am PCBA FA Eng
Burn-in tray for TMCL
1
rel
640
Wed Mar 09, 2026 8:51 am Guest
Thermal fatigue after IOL testing
1
thornbirdhsu
710
Tue Mar 08, 2026 2:26 pm Asi
Forward or reversed related failure of diodes
0
thornbirdhsu
673
Fri Mar 04, 2026 8:39 pmthornbirdhsu
Fractography
1
Guest
674
Thu Mar 03, 2026 2:48 amEE
Power Temp Cycle
2
akoani
698
Tue Mar 01, 2026 10:28 am akoani
Weibull help
0
guest
608
Mon Feb 28, 2026 6:57 pm guest
NSOP cause from Carbond layer
2
Tata
682
Wed Feb 09, 2026 9:25 am Tata
All FA/rel practitioner. You might be interested to join!
0
Bago
665
Fri Jan 28, 2026 2:57 pm Bago
HTOL failure mechanisms
5
rel gal
959
Mon Jan 24, 2026 9:08 pmFARel Engr
Crack on die glassivation layer after T/C
3
Tata
756
Mon Jan 24, 2026 2:30 pm bago
Disposal of Bad Parts and Bare Die
2
Guest
637
Tue Jan 18, 2026 4:30 pm BKT
help (re: 8D Report)
1
mimi baby
623
Mon Jan 10, 2026 7:13 pmFARel Engr
HAST bias resistor value?
1
Richard
580
Mon Dec 27, 2025 1:38 pm Bill G
Control Plan
2
Guest
722
Fri Dec 17, 2025 11:18 pm Guest
Non-planar Oxide Integrated Circuit Wafers
3
Tata
785
Wed Dec 01, 2025 5:48 pm Guest
Si die cracking
4
rel gal
1063
Sun Nov 28, 2025 5:04 pm rel gal
High Temp Storage
1
CS
665
Wed Nov 24, 2025 8:16 pm Rel Eng 99
Peeling of Thin films
0
Drew
646
Sat Nov 20, 2025 7:11 am Drew
IR temp profile for Thin and Thick package
4
Tata
865
Wed Nov 17, 2025 3:30 pm Tata
High temp operation life affect on leakage current
1
rel gal
630
Mon Nov 15, 2025 10:41 amFARel Engr
Is ESD Sometimes Bake-recoverable?
3
Shawie
863
Fri Nov 12, 2025 9:57 pm ESD Engr
No Post Mold Cure
0
shy girl
626
Thu Nov 11, 2025 3:56 pm shy girl
Whisker Test
4
SQ
925
Tue Oct 26, 2025 12:21 pm asem
Procedure for rel failure
2
SQ
730
Mon Oct 25, 2025 12:29 pm asem
backside chipping
4
tops
1220
Wed Oct 20, 2025 9:40 pm daman
PPM Calculation & Lot Acceptance Rate (LAR)
1
Guest
648
Fri Oct 08, 2026 6:31 pm Dayo
why PNP transistor have more short units than NPN?
0
teradyn
618
Fri Oct 08, 2026 5:13 pm teradyn
SiGe & GaAs reliability
0
Guest
613
Fri Oct 01, 2026 5:57 pm Guest
PCT Failures on BGA Package
7
Guest
1412
Mon Sep 27, 2026 9:01 pm rel gal
Cleanroom Class level and suitable air filtration system
0
guest
618
Thu Sep 23, 2026 12:00 pm guest
Stress corrosion cracking in BGA packages
0
rel gal
621
Mon Sep 20, 2026 8:42 pm rel gal
Pre-conditioning
2
Guest
951
Thu Sep 16, 2026 11:23 am guest
Is delam a failure?
10
enimen
2033
Thu Sep 16, 2026 11:19 am guest
Factors causing ball-off in *bga devices
2
Guest
628
Wed Sep 15, 2026 3:49 pm Guest
PPM requirement
1
Shy Girl
540
Tue Sep 14, 2026 6:59 pm siksik
Die crack of semiconductor
1
thornbirdhsu
655
Tue Sep 07, 2026 9:31 pm FA Eng Din
Pre-conditioning & Rel Test
4
Guest
808
Tue Aug 17, 2026 1:36 pm jf
mil-std-883 standard
1
bxhe
558
Tue Aug 17, 2026 11:59 am Guest
Rel Requirements for TO-220 Package
0
SQ
587
Mon Aug 16, 2026 5:09 pm SQ
handling tubes
0
Semicon Engr
642
Sun Aug 15, 2026 11:27 pmSemicon Engr
Wafer/Die thickness Change
1
qtp girl
665
Wed Jul 21, 2026 1:41 pmEE
260C reflow temp vs 220C reflow temp
2
qtp girl
880
Thu Jul 01, 2026 6:01 pm lh
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