QA/FA/Rel Forum
Replies
Author
Views
Last Post
Estimate of Activation Energy
0
Maximus
10
Tue Mar 21, 2026 8:31 pmMaximus
High current consumption
1
Jossix
153
Fri Feb 10, 2026 4:32 pm Guest
Temp Cycle
2
Guest
245
Fri Jan 27, 2026 10:32 am Guest
Solderability test for BGA
0
Sook Fong
138
Thu Jan 26, 2026 11:18 amSook Fong
Flip Chip solder bump
1
Guest
165
Fri Jan 20, 2026 4:57 am Dong
MICROWAVE OVEN SAFE TEST FOR PLASTIC PVC AND TPE-ELASTOMER
0
EP
143
Wed Jan 18, 2026 4:50 pm EP
Mechanical Shock test
0
jarod
206
Wed Jan 04, 2026 2:52 pmjarod
How to measure junction depth( >200um)?
0
oceanwave
225
Fri Dec 30, 2025 1:48 amoceanwave
Cleaning procedure
2
QRA
322
Wed Dec 28, 2025 10:51 am Guest
Dendritic growth after autoclave test
4
IC
436
Mon Dec 19, 2025 1:17 pm Guest
Emission microscopy
2
Guest
380
Fri Dec 09, 2025 8:37 am Guest
One-Sided and Two-Sided Specs
1
Guest
385
Thu Dec 01, 2025 1:54 pmFARel Engr
Resistor Network Tolerance fail
1
Guest1
415
Thu Nov 24, 2025 8:14 pm Mr. Cool
help
6
haha
904
Thu Nov 24, 2025 12:46 pm Guest
Precon to Bias HAST
2
Sebastian
584
Tue Oct 25, 2025 5:23 pmSook Fong
discussion
2
Guest
837
Thu Oct 20, 2025 4:24 pmSebastian
Qualification Samples Preparation
2
RELQAFA
535
Sat Oct 15, 2025 6:00 am RELQAFA
Pb-Free
0
RELQAFA
467
Sat Oct 01, 2026 7:29 am RELQAFA
Compatibility of Pb-free parts and non Pb-free board mount
2
alan
553
Thu Sep 29, 2026 6:24 pm Guest
accelo, gyro
1
Guest
433
Thu Sep 29, 2026 3:17 pmEE
Standard Reliability requirements
0
Learner
457
Wed Sep 28, 2026 6:17 pm Learner
ESD Testing
0
Rel Boy
469
Thu Sep 15, 2026 8:17 pm Rel Boy
Intermetallic inspection - Gold ballbond removal by solder
0
FA Kid
496
Fri Aug 26, 2026 5:32 pm FA Kid
solder joint IMC
0
haha
523
Thu Aug 18, 2026 1:27 pmhaha
Cost of Quality
1
lazyme
565
Thu Aug 18, 2026 9:59 amPolgi-Wan
mold compound qual
1
guest
555
Sun Aug 14, 2026 3:03 pm JV94
Solderability Test Services
1
QA
493
Fri Aug 12, 2026 5:46 am Guest
Does anyone knows how to perform FA on PLL circuit?
3
Simon B.
743
Fri Jul 29, 2026 3:45 pmFARel Engr
Ultrasonic Cleaning on BGAs prior to reliability stressing
3
Sook Fong
793
Thu Jul 28, 2026 10:04 pmGrant
What should I start FA on BGA product
4
tata
1062
Mon Jul 25, 2026 12:22 pm Guest
pre to post delamination change
2
kyle
680
Sun Jul 24, 2026 1:26 pm Guest
Inquiry for Reliability Test
3
Dennis
792
Fri Jul 22, 2026 5:09 pmFARel Engr
92.5/5/2.5 Solde Die Attach Fractured after 1000TC
1
bibo
511
Mon Jul 18, 2026 2:17 pm Guest
Solderability for QFN
0
DND
540
Fri Jul 15, 2026 2:04 pm DND
IR Reflow causes of QFN crack
2
DND
634
Thu Jul 14, 2026 5:04 pm DND
the cause of the low shearing strength
0
Guest
543
Thu Jul 14, 2026 3:33 pm Guest
the different resin , the different whisker test result ?
0
jessielijie
535
Thu Jul 14, 2026 11:11 amjessielijie
How to decap the device with copper wire bond chip ?
3
Guest
1074
Thu Jul 14, 2026 10:23 amjessielijie
QFN package - Solderability test
2
shy girl
786
Fri Jul 08, 2026 5:37 pm DND
FA measureables
3
Guest
1049
Thu Jul 07, 2026 3:07 pmPolgi-Wan
FA Job Outsourcing
2
FA Engineer
941
Wed Jul 06, 2026 10:22 pm oceanwavecn
Failed @ -5C, Intermittent @ 25C, Passed @ 75C
9
FA dude
1415
Mon Jul 04, 2026 6:24 pmFARel Engr
Clean room rqrmnts
2
guest_milqa
645
Sat Jul 02, 2026 4:37 pm quest_milqa
Total Solderball Shear Methodology Inputs
0
GUEST
659
Thu Jun 23, 2026 9:40 am GUEST
Temp cycle applicable spec for PCB assemblies
3
guest
899
Tue Jun 14, 2026 10:40 pmFARel Engr
Backside chipping on bga substrate
0
ProcessEngrGal
694
Mon May 16, 2026 11:51 am ProcessEngrGal
350C rework for solder temp
0
QA Guy
662
Thu May 12, 2026 1:53 am QA Guy
ESD failure statistics
1
morton
695
Mon May 09, 2026 1:59 pm ESDick
Activation Energy
1
guest
669
Fri May 06, 2026 7:48 pm megalis
Any latest FA Techniques on RF/Mixed-Signal Products
2
akotoh
786
Wed Apr 27, 2026 10:49 am Akotoh
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