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QA/FA/Rel Forum		Replies	Author	Views	Last Post
	Estimate of Activation Energy	0	Maximus	8	Tue Mar 21, 2026 8:31 pm Maximus
	High current consumption	1	Jossix	149	Fri Feb 10, 2026 4:32 pm Guest
	Temp Cycle	2	Guest	242	Fri Jan 27, 2026 10:32 am Guest
	Solderability test for BGA	0	Sook Fong	135	Thu Jan 26, 2026 11:18 am Sook Fong
	Flip Chip solder bump	1	Guest	158	Fri Jan 20, 2026 4:57 am Dong
	MICROWAVE OVEN SAFE TEST FOR PLASTIC PVC AND TPE-ELASTOMER	0	EP	138	Wed Jan 18, 2026 4:50 pm EP
	Mechanical Shock test	0	jarod	202	Wed Jan 04, 2026 2:52 pm jarod
	How to measure junction depth( >200um)?	0	oceanwave	223	Fri Dec 30, 2025 1:48 am oceanwave
	Cleaning procedure	2	QRA	319	Wed Dec 28, 2025 10:51 am Guest
	Dendritic growth after autoclave test	4	IC	433	Mon Dec 19, 2025 1:17 pm Guest
	Emission microscopy	2	Guest	373	Fri Dec 09, 2025 8:37 am Guest
	One-Sided and Two-Sided Specs	1	Guest	379	Thu Dec 01, 2025 1:54 pm FARel Engr
	Resistor Network Tolerance fail	1	Guest1	412	Thu Nov 24, 2025 8:14 pm Mr. Cool
	help	6	haha	901	Thu Nov 24, 2025 12:46 pm Guest
	Precon to Bias HAST	2	Sebastian	581	Tue Oct 25, 2025 5:23 pm Sook Fong
	discussion	2	Guest	835	Thu Oct 20, 2025 4:24 pm Sebastian
	Qualification Samples Preparation	2	RELQAFA	531	Sat Oct 15, 2025 6:00 am RELQAFA
	Pb-Free	0	RELQAFA	462	Sat Oct 01, 2026 7:29 am RELQAFA
	Compatibility of Pb-free parts and non Pb-free board mount	2	alan	546	Thu Sep 29, 2026 6:24 pm Guest
	accelo, gyro	1	Guest	429	Thu Sep 29, 2026 3:17 pm EE
	Standard Reliability requirements	0	Learner	452	Wed Sep 28, 2026 6:17 pm Learner
	ESD Testing	0	Rel Boy	463	Thu Sep 15, 2026 8:17 pm Rel Boy
	Intermetallic inspection - Gold ballbond removal by solder	0	FA Kid	490	Fri Aug 26, 2026 5:32 pm FA Kid
	solder joint IMC	0	haha	517	Thu Aug 18, 2026 1:27 pm haha
	Cost of Quality	1	lazyme	558	Thu Aug 18, 2026 9:59 am Polgi-Wan
	mold compound qual	1	guest	549	Sun Aug 14, 2026 3:03 pm JV94
	Solderability Test Services	1	QA	488	Fri Aug 12, 2026 5:46 am Guest
	Does anyone knows how to perform FA on PLL circuit?	3	Simon B.	740	Fri Jul 29, 2026 3:45 pm FARel Engr
	Ultrasonic Cleaning on BGAs prior to reliability stressing	3	Sook Fong	784	Thu Jul 28, 2026 10:04 pm Grant
	What should I start FA on BGA product	4	tata	1052	Mon Jul 25, 2026 12:22 pm Guest
	pre to post delamination change	2	kyle	672	Sun Jul 24, 2026 1:26 pm Guest
	Inquiry for Reliability Test	3	Dennis	783	Fri Jul 22, 2026 5:09 pm FARel Engr
	92.5/5/2.5 Solde Die Attach Fractured after 1000TC	1	bibo	504	Mon Jul 18, 2026 2:17 pm Guest
	Solderability for QFN	0	DND	537	Fri Jul 15, 2026 2:04 pm DND
	IR Reflow causes of QFN crack	2	DND	630	Thu Jul 14, 2026 5:04 pm DND
	the cause of the low shearing strength	0	Guest	540	Thu Jul 14, 2026 3:33 pm Guest
	the different resin , the different whisker test result ?	0	jessielijie	530	Thu Jul 14, 2026 11:11 am jessielijie
	How to decap the device with copper wire bond chip ?	3	Guest	1065	Thu Jul 14, 2026 10:23 am jessielijie
	QFN package - Solderability test	2	shy girl	778	Fri Jul 08, 2026 5:37 pm DND
	FA measureables	3	Guest	1040	Thu Jul 07, 2026 3:07 pm Polgi-Wan
	FA Job Outsourcing	2	FA Engineer	934	Wed Jul 06, 2026 10:22 pm oceanwavecn
	Failed @ -5C, Intermittent @ 25C, Passed @ 75C	9	FA dude	1411	Mon Jul 04, 2026 6:24 pm FARel Engr
	Clean room rqrmnts	2	guest_milqa	643	Sat Jul 02, 2026 4:37 pm quest_milqa
	Total Solderball Shear Methodology Inputs	0	GUEST	656	Thu Jun 23, 2026 9:40 am GUEST
	Temp cycle applicable spec for PCB assemblies	3	guest	890	Tue Jun 14, 2026 10:40 pm FARel Engr
	Backside chipping on bga substrate	0	ProcessEngrGal	688	Mon May 16, 2026 11:51 am ProcessEngrGal
	350C rework for solder temp	0	QA Guy	656	Thu May 12, 2026 1:53 am QA Guy
	ESD failure statistics	1	morton	689	Mon May 09, 2026 1:59 pm ESDick
	Activation Energy	1	guest	665	Fri May 06, 2026 7:48 pm megalis
	Any latest FA Techniques on RF/Mixed-Signal Products	2	akotoh	784	Wed Apr 27, 2026 10:49 am Akotoh
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