Total Solderball Shear Methodology Inputs

Guest

Goodmorning guys.

One of our customers recently wanted to implement the "Total" solderball shear method in our inline monitors. Difference with the traditional is that you get to shear all the solderballs or the solderbumps on the package or the die (for flipchip) or on the csp-chip. They're not concerned with the force monitoring but rather with the failure mode consistency on the die.
We're checking 2 vendors currently, Dage & and XYZTec company fr Netherlands. This request particularly came from our customer's end-customer - - the big cellphone-maker company (also fr Netherlands).

Queries:
- any of you guys out there already implemented this monitor?
- what's the consistency?
- is for the standard eutectic balls or for Pb-free or Hi-Pb balls?
- who's your vendor

Hopefully some of you guys are already pursuing this so we can have inputs as well.

Thanks.