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| Posted: Fri Aug 26, 2026 5:32 pm Post subject: Intermetallic inspection - Gold ballbond removal by solder |
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Tradisional way to inspect Au/Al intermetallic formation can done by wet etching or x-section.
There is a time I heard about someone talking about Au ball bond removal by Pb solder methodology, after that you can perform Au/Al intermetallic inspection on Al BOND PAD to have 3D view, but I lost this technique information.
Does any know about this FA technique ?? |
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