Temp cycle applicable spec for PCB assemblies

Guest

Hi,
Which is the most suitable spec for temp cycling for PCB assemblies ?

Guest

Many companies use JEDEC JESD22-A104 Condition G (-40C/125C) for board-level TC. 500X-1000X depending on what your customer will accept.

RelosR

Guest

THNXS for your reply.
To be specific: what would best fit TSOP type packages on PCB's? regarding, cycles per hour, temp amplitude (min-max) and one more question: what is the effect of a long interim reading that would cause the test to resume after a few days? can the devices be considered to have "relaxed" during the recess and "lost" their "aging"?

Joined: 20 Jun 2026 Posts: 76

If you're using TC to uncover failure mechanisms that it was designed to accelerate, such as mechanical fatigue failures, then long interims shouldn't really 'relax' the damage (which are mechanical and permanent). The issues with long staging in this case is the onset of oxidation or corrosion in your samples, or the occurrence of ESD, so you still need to do the tests as quickly as possible.