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Guest
	Posted: Sun Jan 16, 2026 11:27 pm    Post subject: Disposal of Bad Parts and Bare Die   Hi all, we got this inquiry from the email and decided to post it here so more people can respond to BKT's question. Thanks! Admin Quote: Hi, Will Semiconfareast share the process of disposal/destroy of bad parts(finished product) & bare die (loose dice or wafer form)? BKT
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justcrushem
Guest	Posted: Mon Jan 17, 2026 10:41 pm    Post subject:   in the company where i worked before, we have a crusher that crushed everything into small pieces. then we sell the broken pieces to a buyer of scrap matl. i dont know where he takes them. the crusher area must be under tight security so bad parts can not get out. justcrushem
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BKT
Guest	Posted: Tue Jan 18, 2026 4:30 pm    Post subject: bad part disposal method   crushing the IC pkg is possible. How about the remnant die (residue) on membrane? There is a potential of fly-off escapee during the crush process. Did anyone use heat or chemical to damage the die metallization (or even go beyond to melt/desolve the Si or GaAs substrate)?
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