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Assembly Forum		Replies	Author	Views	Last Post
	electroconductive dicing tape	0	dudi	53	Thu Mar 16, 2026 6:50 pm dudi
	IC subcontractor assy/test in Shenzhen , China	5	asicfrog	284	Thu Mar 16, 2026 5:18 pm crean_yang
	Shinkawa PA 100 die bonder	1	Guest1	167	Thu Mar 02, 2026 10:25 am Gunston
	Dice or die	5	Guest	323	Wed Mar 01, 2026 6:23 pm Polgi-Wan
	Die shear height	1	Kyle790707	301	Wed Mar 01, 2026 3:39 pm Gunston
	wafer bumping	2	El-Kid-de-Sparc	90	Tue Feb 28, 2026 12:45 am Gido
	wirebond books	5	kramski	464	Thu Feb 09, 2026 3:41 am Guest
	What's the Smallest Package Available Today?	6	Assy Engr 2	1639	Tue Feb 07, 2026 8:52 pm Bystander
	MSDS of Surclean	1	neo	144	Fri Jan 27, 2026 8:16 am Guest
	how to judge a good diced wafer	1	kivio	435	Tue Jan 24, 2026 3:38 pm Sebastian
	Stand-off & coplanarity measurement	3	Miguel	384	Tue Jan 24, 2026 3:31 pm Sebastian
	D6000 Sonoscan For Sale	1	Guest	779	Wed Jan 11, 2026 6:51 am Guest
	Sumitomo EMEXXXXU Molding Compound Problem	3	Neo Phyte	1476	Thu Dec 29, 2025 8:29 am Pan-gulo
	Electrical Deflash Concern	1	Waynelin	366	Thu Dec 22, 2025 4:31 pm Guest
	saw street	0	Guest	277	Thu Dec 22, 2025 6:58 am Guest
	DOE	2	donnie liporada	571	Mon Nov 28, 2025 4:17 pm beth
	New Machine Buy-Off and New Product Qualification	1	keenjin	442	Sun Nov 27, 2025 1:51 pm dyords
	Process Engineering Role	10	Amkor SOIC boy	1100	Wed Nov 23, 2025 2:13 am Guest
	Plating Blisters, need help	5	Devil's Advocate	735	Sat Nov 19, 2025 4:58 pm Guest
	The Role of Equipment Engineer???	2	maan	478	Thu Nov 17, 2025 11:36 pm Guest
	Eutectic Temperature for various die back metallizations	5	IkingJr	1777	Wed Nov 09, 2025 1:38 pm Sebastian
	laser marking	5	zorro	1022	Fri Oct 21, 2025 7:32 am Guest
	Tape remnant. Any solution?	1	stephen_sg	574	Thu Oct 20, 2025 5:08 pm Sebastian
	Stacked Die attach using Au/Sn solder, need help	0	aparam	489	Wed Oct 12, 2026 10:15 pm aparam
	Solder Ball (BGA) Visual criteria standards	1	Jefriz	549	Fri Sep 30, 2026 1:24 pm stephen_sg
	Contact Angle	4	jarod	755	Mon Sep 19, 2026 8:17 am Guest
	Backgrind Qual	2	jarod	654	Mon Sep 12, 2026 1:52 pm jarod
	Back side die rounghness	5	DND	1005	Mon Aug 29, 2026 1:06 pm Guest
	SOIC delam	5	balam122	820	Tue Aug 23, 2026 11:54 am Beengg
	DieTop delam after AutoClave due to Solder D/A Overflow???	1	Bewildered Boy	534	Fri Aug 19, 2026 1:38 pm Rel Lab Guy
	Tin dip pot area	0	R.Jaryal	550	Thu Jul 28, 2026 5:06 pm R.Jaryal
	Severe Delamination After Trim and Form	7	Bibo	1120	Fri Jul 22, 2026 9:43 am dtfs boy
	Thermal Conductivity	3	Petrified	801	Thu Jul 21, 2026 7:11 pm FF
	Die Attach Voids on Solder alloy 92.9Pb/5Sn/2.5Ag	0	Guest	564	Thu Jul 21, 2026 4:04 pm Guest
	Shelf life for silver plated leadframe	0	Bala	576	Mon Jul 18, 2026 7:59 pm Bala
	92.5/5/2.5 Solder Alloy Fracture after 1000TC	0	bibo	559	Mon Jul 18, 2026 8:55 am bibo
	low k and lead free devices, any relevant infos?	1	beth	645	Wed Jul 13, 2026 4:13 pm marva
	Contam on Bond Pad	5	Seinfeld	1766	Mon Jul 11, 2026 6:03 pm DND
	Trying to identify die markings...	0	Guest	607	Wed Jul 06, 2026 11:36 pm Guest
	Chip Metallization	4	Mike	1059	Tue Jul 05, 2026 4:36 pm Guest
	Welcome to the Assembly Forum!	1	Guest	1082	Fri Jul 01, 2026 9:24 pm tdt engr
	Package with Highest Lead Count	7	Assy Engr 2	2058	Wed Jun 29, 2026 3:12 pm bea
	Please help me w/ program	1	Vallea	624	Mon Jun 27, 2026 1:26 am Bruce
	Assembly Foundries	4	SATS	1945	Sun Jun 12, 2026 2:59 pm guest
	Energy Band Diagrams	1	Congrats	715	Sun Jun 12, 2026 2:45 pm Chip
	Resolving Ball Lifting Issues	5	Guest	1722	Mon Jun 06, 2026 11:49 pm Guest
	How to prevent backside mold chipping on bga substrate?	4	ProcessEngrGal	1079	Fri Jun 03, 2026 7:21 pm AE engr.
	bright tin vs matte tin	1	guest	756	Tue May 31, 2026 1:19 pm Guest
	samarium cobalt	3	jarod	1037	Tue May 17, 2026 5:26 pm Guest
	What is purple plague?	1	MJ88	1092	Thu Apr 21, 2026 6:23 pm Taurus
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