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Guest	Posted: Thu Jul 21, 2026 4:04 pm    Post subject: Die Attach Voids on Solder alloy 92.9Pb/5Sn/2.5Ag   Is there someone can give me idea how to resolve the solder voids at die attach. We are using 92.5Pb/5Sn/2.5Ag solder alloy for a silicone die with backside metallization of Cr/Ni/Ag. Some question here are: 1. Does the backgrinding process affects the solder flow under the die? If it does, what type of B/G is best suited for this? 2. Does the water marks at the die back side is also a factor to impedes the flow of solder? 3. What should be the forming gas mixing ratio? Any valuable inputs is highly appreciated. Thanks in advanced. New D/A Engineer
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