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Mike
Guest	Posted: Fri Jun 10, 2026 3:22 pm    Post subject: Chip Metallization   Anybody know about metallization of wire bond pad like Al/Ti ?
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Chip
Guest	Posted: Sun Jun 12, 2026 2:42 pm    Post subject:   Other kinds of die metallization: - pure Al - Al / 4%Cu - Al / 2%Si - Al / 4% Cu / 2% Si - Al / 1.2% Si / .15% Ti - Al / 0.1-0.5% Ti - etc., etc. In other words, there are many possible alternatives.
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Mike
Guest	Posted: Mon Jun 13, 2026 4:56 pm    Post subject:   Thanks. Could you tell me typical thickness of metallization?
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Guest
	Posted: Fri Jun 17, 2026 1:46 pm    Post subject:   how about aluminum fluoride? anyone here heard of that or had encountered that problem??? and what are some metallizations that are most can be seen visually by inspection?
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Guest
Guest	Posted: Tue Jul 05, 2026 4:36 pm    Post subject:   Hi Mike: Metallizations ? You meaning the typical IMC thickness ? Normally, It's base on gold ball shear or will pull to judge the wire bonding quality and the both of test values and defect mode is very important for this. You can using cutter to cross-section and then to do SEM for inspection IMC layer and EDS(EDX) to measure it if you interest. The Poor IMC also will cous hi resistance during F/T. For you reference.
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