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| El-Kid-de-Sparc |
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Joined: 23 Jun 2026
Posts: 7
Location: Espana
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| Posted: Mon Feb 27, 2026 3:06 pm Post subject: wafer bumping |
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what is wafer bumping?
i'm a test engineer and i think this is for package development folks. . . |
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| tasya |
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Guest
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| Posted: Mon Feb 27, 2026 8:48 pm Post subject: Re: wafer bumping |
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| El-Kid-de-Sparc wrote: | what is wafer bumping?
i'm a test engineer and i think this is for package development folks. . . |
i-google mo... peace!
kidding aside, im also interested on this topic, let's wait for other forumers to reply on this post but for the mean time, try the powerful world wide web, got so many related literatures out there.... |
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| Gido |
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Guest
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| Posted: Tue Feb 28, 2026 12:45 am Post subject: |
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Wafer bumping --> the process of putting metal alloy bumps (or balls) on the bond pads of the wafers. These are protrusions that will allow electrical interconnection of the die with the package without the need for bonding wires. Examples is a flip-chip on a substrate.
Read: http://www.semiconfareast.com/flipchipassy.htm |
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