Tape remnant. Any solution?

Joined: 30 Sep 2026 Posts: 2

We encounter tape remnants after DA process.

The tape remnants are basically adhensive tape's whisker. Pls see below.

Excessive tape after Die pick up

tape whisker on lead, after attachment on Substrate .

We are sure of a complete cut during dicing process.

Any comment for the above?

Our process flow is as follow...
WF Mount => UV Cure => Dicing => DA

Joined: 31 Jan 2026 Posts: 21

Hi,

Since UV is done after WM, i would assume you are using UV tape...

First, am not sure why you perform UV after WM. What is it for? Isn't UV exposure done prior DA to lessen the adhesion of the tape to the bottom of the die for better ejection?

You might want to simulate this scenario by mounting a UV tape (without wafer) on the wafer ring. Have it exposed to UV and load to Wafer Saw machine using the same program/blade, etc. Then check for the "kerf" of the UV tape for some tape remnants. My take is that the UV tape may have degraded when it was subjected to DI water after UV exposure. I always knew that UV is done prior DA, not prior Saw.

Hope this helps.