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Waynelin
Joined: 07 Dec 2025 Posts: 1 Location: Shanghai, PRC	Posted: Wed Dec 07, 2025 2:46 pm    Post subject: Electrical Deflash Concern   Recently we observed delamination on the interface of molding compound and Ag-spotted pad. The delamiantion is most likely initiated from the die corner and further extended during following thermal annealing process. We checked the C-SAM images of samples with ED(electric deflashing) and w/o ED during plating. Delamination was found for those with ED process but not for those without ED process. Does anyone have the same experience before? What will be the delamination mechanism?? Appreciate for any input. Thanks Best Regards, Wayne
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Guest
	Posted: Thu Dec 22, 2025 4:31 pm    Post subject: Re: Electrical Deflash Concern   is your ED process just an immersion type or succeeded with a high pressure rinse? Is it performed inline or offline? are u using acid or alkaline? handling or loading also can contribute in the occurrence of delam. Waynelin wrote: Recently we observed delamination on the interface of molding compound and Ag-spotted pad. The delamiantion is most likely initiated from the die corner and further extended during following thermal annealing process. We checked the C-SAM images of samples with ED(electric deflashing) and w/o ED during plating. Delamination was found for those with ED process but not for those without ED process. Does anyone have the same experience before? What will be the delamination mechanism?? Appreciate for any input. Thanks Best Regards, Wayne
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