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1. What is a Semiconductor?

        1.1  p-n junction

        1.2  Junction Diode

        1.3  Bipolar Transistor

        1.4  MOSFET

        1.5  JFET

2. Semiconductor Manufacturing

        2.1 Wafer Fab

             2.1.1   Incoming Wafers

                2.1.2   Epitaxy

                2.1.3   Diffusion

                2.1.4   Ion Implant

                2.1.5   Polysilicon

                2.1.6   Dielectric

                2.1.7   Lithography/Etch

                2.1.8   Thin Films

                2.1.9   Metallization

                2.1.10 Glassivation

                2.1.11 Probe/Trim

        2.2 Assembly

              2.2.1   Wafer Backgrind

               2.2.2   Die Preparation

               2.2.3   Die Attach

               2.2.4   Wirebonding

               2.2.5   Die Overcoat

               2.2.6   Molding

               2.2.7   Sealing

               2.2.8   Marking

               2.2.9   DTFS

               2.2.10 Lead Finish

        2.3 Test

             2.3.1   Electrical Test

               2.3.2   Burn-in

               2.3.3   Marking

               2.3.4   Tape and Reel

               2.3.5   Dry Packing

               2.3.6   Boxing/Labeling

3. Semiconductor Equipment

        3.1 Wafer Fab Eqpt

        3.2 Assembly Eqpt

        3.3 Test Eqpt

4. Semiconductor Materials

       4.1 Leadframes

       4.2 Die Attach Matls

       4.3 Molding Compounds

       4.4 Chemicals and Gases

5. Failure Analysis

       5.1 Failure Analysis Techniques

                5.1.1   Failure Verification

                5.1.2   Optical Microscopy

                5.1.3   Xray Radiography

                5.1.4   Decapsulation

                5.1.5   Cross-sectioning

                5.1.6   Microthermography

                5.1.7   Photoemission Microscopy

                5.1.8   Microprobing

                5.1.9   Die Deprocessing

                5.1.10 Focused Ion Beam

                5.1.11 SEM/TEM

                5.1.12 Scanning Acoustic Microscopy     

                5.1.13 Other FA Techniques

        5.2 Die Failure Mechanisms

                5.2.1   Contact Migration

                5.2.2   Die Corrosion

                5.2.3   Die Scratches

                5.2.4   Dielectric Breakdown

                5.2.5   Electromigration

                5.2.6   EOS

                5.2.7   ESD

                5.2.8   Gate Oxide Breakdown

                5.2.9   Junction Burn-out

                5.2.10 Metal Burn-out

                5.2.11 Mobile Ionic Contam

                5.2.12 TDDB

         5.3  Package Failure Mechanisms

                5.3.1   Bond Shorting

                5.3.2   Brand Attributes

                5.3.3   Contamination, Ext.

                5.3.4   Contamination, Int.

                5.3.5   Cratering

                5.3.6   Die Chip-outs

                5.3.7   Die Corrosion

                5.3.8   Die Cracking

                5.3.9   Die Lifting

                5.3.10 Die Scratches

                5.3.11 Heel Breaks

                5.3.12 Lead Corrosion

                5.3.13 Lead Pulling

                5.3.14 Lead Tearing

                5.3.15 Neck Breaking

                5.3.16 Pkg Cracking, Ceramic

                5.3.17 Pkg Cracking, Plastics

                5.3.18 Pkg Delamination

                5.3.19 Seal Cracking

                5.3.20 Wedge Lifting

                5.3.21 Wire Breaking     

                5.3.22 Wire Depression

                5.3.23 Wire-to-Die Shorting

                5.3.24 Wire-to-Wire Shorting

                5.3.25 Wrong Bonding

         5.4 Basic FA Flows

6. Reliability Engineering

         6.1  Reliability Tests

               6.1.1   Solder Heat Resistance Test

                 6.1.2   Autoclave Test or PCT

                 6.1.3   Temperature Cycling

                 6.1.4   Thermal Shock

                 6.1.5   Temp, Humidity, Bias (THB)

                 6.1.6   Highly Accel. Stress Test (HAST)

                 6.1.7   HighTemp Oper Life Test (HTOL)

                 6.1.8   Low Temp Oper Life Test (LTOL)

                 6.1.9   High Temp Storage (HTS)

                 6.1.10 Other Reliability Tests

        6.2 Process Qualification

        6.3 Reliability Modeling

7. Quality Assurance

        7.1  Quality Systems

        7.2  Proc Monitors/Controls

        7.3  Metrology & Calibration

        7.4  Document Control

8. What is ESD?

        8.1  ESD Audit Checklist

        8.2  ESD Controls

9. FORUMS

        9.1  Semicon Chika

        9.2  Assembly Forum

        9.3  Test Forum

        9.4  Vendors' Forum

        9.5  Special Events Forum

10. Quick References

      10.1  Acronyms

        10.2  Package Outlines

        10.3  JEDEC Specs

        10.4  MIL-STD Methods

        10.5  IPC/JEDEC Moisture Sensitivity Levels

        10.6  LTPD/AQL Sampling