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| Jerry Zhong |
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Joined: 06 Apr 2026
Posts: 3
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| Posted: Tue May 18, 2026 4:58 pm Post subject: Back Metal Peeling |
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We are headache of back metal peeling problem.
What kinds of possible causes can make this defect? How to avoid? |
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| Guest |
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| Posted: Wed May 19, 2026 2:06 pm Post subject: |
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jerry,
when u say back metal, what exactly do u mean? the barrier metal between the bond pad and the silicon die? or the silver plating on the lead frame? or the metal coating on the die backside (like gold or platinum?)? etc. what package is this? pls clarify. |
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| Jerry Zhong |
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Joined: 06 Apr 2026
Posts: 3
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| Posted: Thu May 27, 2026 7:55 am Post subject: |
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The metal coating on the wafer backside, now we use silver. The peeling is found after D/B.
The waer is for POWER MOSFET package.
Thank you to give some advice. |
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