help

Joined: 18 Aug 2026 Posts: 3

I have a device, it was function fail, but after decapped, it became normal. Who can explain this?

Joined: 20 Jun 2026 Posts: 76

Did you either do a chemical decap and/or bake the unit afterwards? Removal of external contam during chemical decap and 'healing' of the failure during bake are two of the most common causes of unit recovery.

BTW, are you sure that the unit is indeed bad before you decapped it? It could be an invalid test failure to begin with. Wink

FARel Engr

Joined: 18 Aug 2026 Posts: 3

There are many units failed in function. After baking, same units became normal. Is this caused by ionic contam?

Guest

Baking can make 'bad' units recover in many ways. Examples of failures that can recover by bake:
- leakage due to package moisture
- leakage due to package contam (baking will 'dry' or decompose the contam)
- mobile ionic contam (need to fail again with applied bias to confirm this)
- package stress (high temp allows package to readjust to less stress)
- hot carrier effects (trapped charges become free again)

Berns

Posted: Thu Sep 29, 2026 7:36 am Post subject: Re: help

Ano ba ang functional failure mode mo in the first place at ano klase yung device mo at package?

Posted: Thu Sep 29, 2026 6:14 pm Post subject:

check any package crack.

Posted: Thu Nov 24, 2025 12:46 pm Post subject:

What if there's no package crack?