Joined: 15 Jul 2026
Posts: 3
Location: Malaysia
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| Posted: Thu Jan 26, 2026 11:18 am Post subject: Solderability test for BGA |
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Hi,
I'd like to understand how the semiconductor industry performs solderability test on BGA parts.
If the JESD22-B102D Method 2 is used, the process include:
a) Preconditioning, if applicable.
b) Print solder paste.
c) Place component on solder paste.
d) Reflow, cool and remove flux.
e) Examination and evaluation of the tested terminations.
What is your accept/reject criteria for the post-test joint inspection?
Thanks,
SF |
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