| |
| Guest |
|
|
| Posted: Mon Mar 21, 2026 4:03 pm Post subject: Voltage or Temperature Testing for Screening purpose |
| |
I am looking for information regarding Guard Band or Dynamic Voltage testing for screening purpose, any Help or literature info would be greatly appreciated
Syed |
|
| Back to top |
|
| EE |
|
Joined: 16 Jun 2026 Posts: 134 Location: Paranaque City, Phils.
|
| Posted: Mon Mar 21, 2026 7:31 pm Post subject: |
| |
Hi Syed,
You need to tell us what failures you are trying to screen out. Without knowing this nobody can give you any inputs. If your question is about electrical testing in general, then we need to transfer this post to the Test Forum. Let me know and we can do the transfer ourselves.
By the way, I deleted your duplicate post in the Assembly Forum.
Thanks for posting,
EE |
|
| Back to top |
|
| Guest |
|
|
| Posted: Tue Mar 22, 2026 7:41 am Post subject: |
| |
Thanks for your reply, my question is basically screening parts at room or accelerated temperatures and voltages using differnet electrical testing methods to exposed any process or asssemby related problems, such as IDDQ testing by using bininng distribution.
Thanks
Syed |
|
| Back to top |
|
| EE |
|
Joined: 16 Jun 2026 Posts: 134 Location: Paranaque City, Phils.
|
| Posted: Tue Mar 22, 2026 9:43 am Post subject: |
| |
Syed,
Since we don't have enough info regarding your question (which is really quite vague to me), I will give you a general answer:
If you want to screen out gross assembly failures such as lifted/shorted bonds, broken/shorted wires, die cracks, etc., then a simple functionality test is all you need. Some intermittent failures such as intermittently open pins may need functional testing at two different temperatures (say, ambient and 125 deg C).
Leakage-related assembly issues such as solder microbridging between leads will require leakage tests.
Most of the assembly failures encountered can be readily screened out by conventional electrical test programs, so my suggestion is for you to first discuss your concerns with your Test department.
If you need more details, you'll have to provide us a list of which assembly failures you are concerned with before we can give a more definitive answer.
Thanks for posting and good luck!
EE |
|
| Back to top |
|
| Choose Display Order |
|
| User Permissions |
You cannot post new topics in this forum You cannot reply to topics in this forum You cannot edit your posts in this forum You cannot delete your posts in this forum You cannot vote in polls in this forum
|
Skin Created by: Sigma12 Powered by phpBB © 2001, 2002 phpBB Group
|
|