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FARel Engr
Joined: 20 Jun 2026 Posts: 76	Posted: Tue Jan 20, 2026 10:58 am    Post subject: FA Conclusion After IRR and PCT   Hi all, I am posting this question on behalf of thunder. Thanks, FARel Engr Quote: Thunder's Question: Another Q. There failed units on reliability test like PCT and IRR and during failure analysis found no visual anomalies on the die/package. Is it right to conclude that the failure is wafer fab/die related?
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FARel Engr
Joined: 20 Jun 2026 Posts: 76	Posted: Tue Jan 20, 2026 11:01 am    Post subject:   And I'll answer it too... No, Thunder, it would not be OK to point to fab if you don't see any assy-related defects. Whenever pointing to a cause, you must support your conclusion with hard FA evidence. Unfortunately, this is not always easy to do. If you have no evidence one way or the other, it would be better to just say that the failure mechanism and cause were not determined even after full FA. FARel Engr
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Guest
	Posted: Sat Feb 14, 2026 2:55 am    Post subject: PCT Failure on BGA Device   We did PCT on a BGA device and found SCAN failure during ATE. No continuity and leakage failure and obvious package failures found after FA. JEDEC standard says that PCT should not be applied to laminated devices, such as BGA. Can I dismiss the failures?
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