Author	Message
Topic: Solderability test for BGA
Sook Fong Replies: 0 Views: 138	Forum: QA/FA/Rel Forum   Posted: Thu Jan 26, 2026 11:18 am   Subject: Solderability test for BGA
	Hi, I'd like to understand how the semiconductor industry performs solderability test on BGA parts. If the JESD22-B102D Method 2 is used, the process include: a) Preconditioning, if applicable. ...
Topic: Precon to Bias HAST
Sook Fong Replies: 2 Views: 584	Forum: QA/FA/Rel Forum   Posted: Tue Oct 25, 2025 5:23 pm   Subject: Precon to Bias HAST
	Hi Sebastian, The moisture absorped during precon is to simulate popcorn failure during reflow. If the package pass precon, it is fine. I'd recommend to keep the parts in dessicator or seal them ...
Topic: Ultrasonic Cleaning on BGAs prior to reliability stressing
Sook Fong Replies: 3 Views: 793	Forum: QA/FA/Rel Forum   Posted: Fri Jul 15, 2026 2:19 pm   Subject: Ultrasonic Cleaning on BGAs prior to reliability stressing
	I'm doing reliability qualification on BGA parts. During preconditioning, some ionic contamination may be introduced to the parts so we perform Ultrasonic cleaning before any reliability stress such a ...