![]() |
||||
|
Ball Bond Neck Breaks
Neck Breaking is the severing of the wire from its ball bond due to a fracture in the neck. The neck is the portion of the wire where the wire meets the ball bond. The geometrical transition of the wire at the neck makes this portion vulnerable to the thermo-mechanical stresses that the wires are subjected to.
Die overcoat
material reaching the neck regions of the bonds can likewise cause neck
breaks. Silicone gel coat
exerts tremendous forces on the wires if the unit is subjected to
excessive thermal stresses, pulling the necks away from their ball bonds. This mechanism can be easily prevented though by limiting the
die coat thickness, i.e., not letting the die coat level reach the neck
portion of the wires.
Neck
breaks as a result of
wire sweeping during molding can also occur.
Excessive wire sweeping produces both a linear and angular
displacement of the wire, which tend to pull on and twist the neck of
the ball bond. The neck is
severed if its fracture strength is exceeded by the resultant stress.
Taut wires and low loop heights aggravate the effects of wire sweeping.
Die-to-plastic delaminations, such as those induced by an improper DTFS
process, can likewise result in neck breaks, since any movement of the
delaminated plastic with respect to the die would tend to pull away the
wires from the die.
Corrosion,
which can significantly reduce the diameter of a bond wire, can also
lead to neck breaks.
Neck breaking
may be
accelerated
by SHRT,
Temp Cycle, and Thermal Shock.
See also
Copyright © 2005. SemiconFarEast.com. All Rights Reserved. |
||||