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Joining Processes - Page 2 of 2
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Welding, Brazing>
Soldering
is a joining process that's similar to
brazing,
except that it is performed at much lower temperatures than brazing.
Thus, soldering is also a
In semiconductor
manufacturing, one common application of soldering as a joining method
is in eutectic die attach.
This is a process for mounting the die on the package cavity using a
metal preform that forms a eutectic alloy with the die.
Adhesive Bonding
is a process for joining parts using bonding chemicals or materials
known as adhesives. It is employed to join polymers and
polymer-matrix composites, as well as polymers to metals, metals to
metals, and ceramics to metals. Adhesive-bonded joints can
withstand shear, tensile, and compressive stresses, but they do not
exhibit good resistance against peeling. To overcome the weakness
of adhesive bonding against peeling, joints mated together by adhesives
must have a good design, i.e., the adhesion area is maximized and
mechanical interlocking is employed.
High adhesive
bond strength is achieved if chemical bonds are formed between the
adhesive and the base material, or adherent. However, compared to
welding, brazing, and soldering, it is not easy to achieve primary
bonding (ionic, covalent, and metallic) in adhesive bonds because of the
relatively larger interfacial gaps between the adhesive and the
adherent. Secondary bonds, which do not involve electron transfer or
electron sharing but instead rely on coulombic forces of attraction, is
therefore more likely to form in adhesive bonding.
To maximize
adhesive bonding strength, surfaces to be joined by adhesives must be
cleaned thoroughly. This, in essence, minimizes the interfacial
gap between the adhesive and the adherent. Making the surfaces
'rough' also improves adhesive bond strength because of the mechanical
interlocking that the 'roughness' provides.
Adhesive
bonding is also widely used in semiconductor manufacturing, a common
application of which is
adhesive die attach.
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