Joining Processes - Page 2 of 2

                         

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Soldering is a joining process that's similar to brazing, except that it is performed at much lower temperatures than brazing.  Thus, soldering is also a process of joining two work pieces together with a filler metal, such that only this filler metal undergoes melting, i.e., the work pieces do not experience any melting.  Brazing materials are those that melt above 450 deg C, so soldering materials would be those that melt at less than 450 deg C. 

                    

     

Common soldering materials include tin-lead, tin-zinc, lead-silver,  and cadmium-silver alloys.  Like welding and brazing, soldering also employs flux materials to clean the surface to be soldered and improve metallurgical bonding.  Residues from fluxes, however, must be removed after soldering to reduce the risk of the occurrence of corrosion.

   

In semiconductor manufacturing, one common application of soldering as a joining method is in eutectic die attach. This is a process for mounting the die on the package cavity using a metal preform that forms a eutectic alloy with the die.   

                    

Adhesive Bonding is a process for joining parts using bonding chemicals or materials known as adhesives.  It is employed to join  polymers and polymer-matrix composites, as well as polymers to metals, metals to metals, and ceramics to metals.  Adhesive-bonded joints can withstand shear, tensile, and compressive stresses, but they do not exhibit good resistance against peeling.  To overcome the weakness of adhesive bonding against peeling, joints mated together by adhesives must have a good design, i.e., the adhesion area is maximized and mechanical interlocking is employed.

  

High adhesive bond strength is achieved if chemical bonds are formed between the adhesive and the base material, or adherent.  However, compared to welding, brazing, and soldering, it is not easy to achieve primary bonding (ionic, covalent, and metallic) in adhesive bonds because of the relatively larger interfacial gaps between the adhesive and the adherent. Secondary bonds, which do not involve electron transfer or electron sharing but instead rely on coulombic forces of attraction, is therefore more likely to form in adhesive bonding.

       

To maximize adhesive bonding strength, surfaces to be joined by adhesives must be cleaned thoroughly.  This, in essence, minimizes the interfacial gap between the adhesive and the adherent.  Making the surfaces 'rough' also improves adhesive bond strength because of the mechanical interlocking that the 'roughness' provides.

      

Adhesive bonding is also widely used in semiconductor manufacturing, a common application of which is adhesive die attach.

             

Diffusion Bonding, or diffusion welding, is a solid-state joining process wherein the joined parts undergo no more than a few percent macroscopic deformation.  It can be accomplished at temperatures higher than half the absolute melting point of the base material.  Diffusion bonding generally occurs in two stages: 1) deformation processes that result in the surfaces to be joined coming into intimate contact; and 2) formation of bonds by diffusion-controlled mechanisms such as grain boundary diffusion and power law creep.  Diffusion bonding is capable of joining a vast array of combinations and sizes of metal and ceramic parts.

                     

Mechanical Joining is a process for joining parts through mechanical methods, which often involve threaded holes. Joining parts using screws or nuts and bolts are common examples of mechanical joining.  The threaded holes employed for mechanical joining are vulnerable to fractures.  In ductile materials, the fracture can come from fatigue, while in brittle materials, the fracture can simply result from mechanical overloading. Thus, mechanical joints must be designed with fatigue failure and brittle fracture in mind.  Another issue to be considered when designing mechanical joints is galvanic corrosion, which is a type of corrosion that affects different types of metals that are in contact with each other.  

                              

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