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SELECTED JEDEC STANDARDS For a more complete list of standards, pls see http:www.jedec.org
JESD22-A100 - CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST
This document pertains to the Cycled Temperature-Humidity-Bias Life Test, which is performed to evaluate the reliability of non-hermetically packaged solid state devices in humid environments. It employs conditions of temperature cycling, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors that pass through it.
JESD22-A101 - STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
This standard establishes a defined method for performing a temperature humidity life test with bias applied. The test is used to evaluate the reliability of non-hermetically packaged solid state devices in humid environments. It employs high temperature and humidity conditions to accelerate the penetration of moisture through external protective material or along interfaces between the external protective coating and conductors or other features which pass through it.
JESD22-A102 -
ACCELERATED
MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
This standard
pertains to the Unbiased Autoclave Test, which is performed to
evaluate the moisture resistance of non-hermetically packaged solid state
devices. It is a highly accelerated test which employs conditions of
pressure, humidity and temperature under condensing conditions to
accelerate moisture penetration through the external protective material (encapsulant
or seal) of the package or along the interface between the external
protective material and the metallic conductors passing through it.
JESD22-A104
-
TEMPERATURE
CYCLING
This standard
provides a method for determining solid state devices' capability to
withstand exposure to alternating cycles of extremely high and extremely
low temperatures. The worst-case load temperature must reach the specific
extremes to ensure proper sample stressing regardless of chamber loading. Definitions
are provided for Load, Monitoring Sensor, Worst-Case Load Temperature, and
Working Zone.
JESD22-A105
-
POWER AND TEMPERATURE
CYCLING
This document
establishes a method for determining the ability of a device to withstand
JESD22-A106
-
THERMAL
SHOCK
This document
defines the requirements of Thermal Shock testing, which is conducted to determine the
resistance of a part to exposure to sudden and extreme changes in
temperature, as well as its resistance to the alternating exposures to
extremely high and low temperatures.
MORE
LINKS to JEDEC SPECS:
<Packaging: Handling/Using Moisture Sensitive Devices,
etc.>
<Reliability Testing: Precon, HAST, Salt
Atmosphere, Operating Life, ESD>
<Package Testing: Visual, Solderability,
Mechanical, Lead Integrity>
<Package Testing: RTSH, Coplanarity, Flip Chip
Pull, WB/Solder Ball Shear>
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