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Finite Element Analysis (FEA) - Page 2 of 2
<Back to Page 1 - Intro to Finite Element Analysis>
Still,
companies who can afford to set up FEA capability should do so, because
the system cost will be negligible compared to failures that may arise
from inadequate design or modeling capability. Prevention of
costly over-designs will also help pay for the FEA system.
Figure 2.
3-D FEA plots showing how a beam of a micromachined
electromechanical system (MEMS) would behave under different excitation
frequency
levels; source: www.algor.com
- continuous
improvement of IC package designs and material sets;
- stress analysis of
adhesive bonding and design of bonded joints;
- fracture mechanics and
fatigue analysis of adhesive bonds;
- thermal
stress and
deformation analysis of solder joints;
- fracture mechanics of
solder joints for solder joint reliability studies;
-
thermo-mechanical stress analysis of interfaces within a package;
- comparative
analyses between flip-chip and wirebonded package configurations;
- thermal,
mechanical, and electrical modeling for various leadframe designs and
materials;
- simulations
of wirebond and die attach fatigue failures;
- selection
of the correct wire diameter, arrangement and profile given the current
loads;
- modeling of the vibration
responses of beams in micro-machined silicon accelrometers; etc.
Figure 3.
An FEA contour plot of the electric field surrounding
a TIP field emitter;
<Back to Page 1 - Intro to Finite Element Analysis>
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