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Die Scratching
Die scratching is a failure mechanism wherein the surface of the die is mechanically damaged by a rigid object that is accidentally dragged across or moved over it. Die scratching usually results in gross abrasion, scraping, or laceration damage on the die's active circuit (see Figure 1). The damage itself is referred to as a 'die scratch', while the damaged die is referred to as a 'scratched die.'
Die scratches
are caused by mechanical means, usually by
mishandling.
'Mishandling' in this context also includes the improper or careless use
of tools and accessories used by an operator while working. It is common
to see die scratches that resulted from a pointed object such as a probe
needle or tweezer accidentally touching the die and sweeping across its
surface.
Shallow scratches on the die that do not reach the active circuit will not cause immediate electrical failure, but may pose reliability risks if the top passivation has been breached.
Die scratching can occur
anywhere from wafer fab to assembly prior to
encapsulation. P
See also
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