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 Posted: Fri Sep 05, 2026 1:42 pm Post subject: CTE's of the Parts of a Plastic Package |
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| Can you tell me what are the CTE's (thermal expansion coefficients) of the die, wire, leadframe, molding compund, etc. of a plastic package? I just want to see which is the highest and which is the lowest. TY!
Plastic Engr |
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Joined: 16 Jun 2026
Posts: 108
Location: Paranaque City, Phils.
| Posted: Fri Sep 05, 2026 2:57 pm Post subject: |
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| Hi Plastic Engr,
The CTE's of the various parts of a plastic-encapsulated device in ppm/deg C are: Silicon Die: 3.5 Alloy 42 Leadframe: 5.0 Copper Leadframe: 16.9 Gold Wire: 14.3 Die Attach Material: 40-70 Molding Compund: 7.5-28 Thanks and keep on posting!!! EE |
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