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Chick Boy
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 Posted: Thu Aug 07, 2026 11:54 am Post subject: Anyone familiar with SOL? |
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Anyone familiar with a new package called SOL?
Chick Boy
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chinoy
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| Posted: Wed Aug 20, 2026 6:28 am Post subject: |
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chick boy,
a quick look with google told me it means "Sea of Leads". here's how georgia tech described it.
chinoy
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Sea of leads (SoL) technology is proposed as an enabling packaging technology for current and future semiconductor packaging demands. SoL is a novel ultra high input/output (I/O) density package (>104 x-y-z compliant leads per cm2) that enables high bandwidth and high current distribution capacity for system-on-a-chip (SoC) applications.
A prototype SoL package with 12,000 leads per cm2 has been designed and fabricated using our compliant wafer level package (CWLP) processing approach. The I/O density of the package is maximized by designing various lead lengths as a function of the necessary in-plane mechanical compliance, which increases linearly from the center of the packaging area.
In addition, the leads are oriented along the die’s local directions of expansion to provide a higher degree of compliance. Two different lead lengths (53 um leads on a 80 x 80 um square lattice, and 106 um leads on a 80x 160 um rectangular lattice) totaling 12,000 leads per cm2 are distributed across a 1 cm2 die.
The array leads present minimal electrical parasitics, and hence are suitable for high frequency and high current transmission. In addition, SoL fabrication utilizes wafer level processing for low cost manufacturing. In essence, SoL extends wafer level batch processing of multilevel interconnects networks to include chip I/O leads.
Using SoL, this packaging technology is projected to far exceed the 1999 ITRS 35 nm generation projection for any packaging technology in both I/O density and cost. |
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EE
Joined: 16 Jun 2026
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Location: Paranaque City, Phils.
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