EE
Joined: 16 Jun 2026 Posts: 108 Location: Paranaque City, Phils.
|
Posted: Thu Jul 24, 2026 10:44 am Post subject: |
|
|
Hello DUTcom,
If you're referring to the process of baking the parts then sealing them in vacuum inside a moisture-resistant bag, then this is to ensure that the units will arrive at the customers' factory with negligible internal moisture. Excessive internal package moisture induces popcorn cracking during board mounting, so this bake-and-bag process is simply for preventing this phenomenon. Pls refer to Dry Packing in the Test section of Semicon Manufacturing on the home page for more details.
Thanks and keep on posting!!!
EE
|
|