Package with Highest Lead Count

Guest

Which IC has the highest lead count today? What is its package?

Assy Engr 2

Posted: Fri Sep 12, 2026 10:51 am Post subject:

Hi Assy Engr 2,

I don't know which particular IC has the highest lead count today, but there’s this new package called the Land Grid Array (LGA) which is said to be thinner, lighter, cheaper, ‘greener’, and of higher pin count than other packages. This package connects to the board or substrate through thin and flat lands that are more robust than balls.

There is really a trend toward very high pin counts for LGA. The following is a list of existing LGA’s with I/O counts of more than 600: LGA 0.8mm, LGA 1.0mm, IBM OLGA P4, Sun ceramic LGA SPARC III and Sun SPARC IV and V.

I also read somewhere that 60 percent of LGA’s will have pin counts of over 1000 pins (average = 2,820 pins) by 2006.

EE

Joined: 31 Jan 2026 Posts: 21

I think FCBGA (Flip Chip Ball Grid Arrays) should be the package with highest I/Os...at least for now. A 27mm x 27 mm package could cater as much as 1500 to 2000 I/Os. This is packaged in a way that the die has solder bumps (usually high Pb) instead of bonding pads. It is then "flipped" (hence the name flip chip) to the substrates with SOP (solder on pad) and reflowed attaching the die to the substrates.

I think when "stack die" packaging is developed, it will even have more I/Os...probably 5000 or more per package.

Posted: Thu Feb 10, 2026 11:32 am Post subject:

Are there leads on a flip chip or LGA? I think these are leadless.

Joined: 31 Jan 2026 Posts: 21

Posted: Thu Feb 10, 2026 4:29 pm Post subject:

I guess you're correct to point that out, guest.

BTW, what's the generic term for the package feature that provides the external connection (i.e., leads, balls, lands, etc.) to the outside world? 'I/O' is sometimes used but Test guys normally don't count the supply pins as I/O's, since they reserve the term for, well, I/O pins.

Also, as a follow-up question on this topic (and out of curiosity), what is already the highest I/O count (if that's the proper term) for any package assembled here in the Philippines? Does anybody know?

Thanks and keep on posting, guys!!!

EE

Joined: 31 Jan 2026 Posts: 21

Guest

we have assembled an FCBGA package size of 45mm x 45mm with an I/O of 1956, and also a 50mm x 50mm package size with more than 2000 I/O... and definitely there would still be more....