 Posted: Fri Dec 24, 2025 2:09 pm Post subject: How to decap the device with copper wire bond chip ? |
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| We have a problem to perform decapsulation on device with cu wire bonded using HNO3:H2SO4 solution. This is bcoz HNO3 solution will attack Cu wire. Any other method that can decap the SiC compound device without attack on Cu copper wire ? appreciated the feedback... |
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