Moldtech,
Though I don't have any experience with Hitachi compounds, I've previously had problems with sticking.
First of all, does Cel 9200H13 have a compatible mold conditioner? The usual problems with the new compounds is that the conditioners have not been able to catch up. You may want to review your mold cleaning and conditioning procedures and probably increase its frequency, this could greatly enhance release of the shot.
For the cull sticking, what's the finish of your plunger/s, matte or mirror? Current trends go for matte finish plungers, the logic here is that mold release agents would be deposited on the valleys and troughs of the matte there by enhancing the release of the cull after every shot.
For degating, does your process employ a degater or is it done manually?
Also, how wide are your mold gates? Manual degating depends greatly on distance between the package and the runner and on the width of the gates and the adhesion index of the molding compound. To be more specific, degating depends on the gate area and how sticky the mold compound is. If you're doing manual degate, there's not much to do.
If you have a degater, you could adjust the cooling time and the tooling distance.
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