Is the Pkg Type Related to ESD Sensitivity?

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Is the package type of an IC related to its ESD sensitivity? How?

Assy Engr 2

Posted: Tue Sep 16, 2026 4:25 pm Post subject:

Hi Assy Engr 2,

ESD sensitivity is normally viewed as a function of the circuit itself, while package choice is usually dictated by what the customers want in their applications. Nonetheless, there are indeed package-related factors that should (at least, theoretically) affect the susceptibility of a device to ESD damage.

For instance, the body size, shape, and composition of a package should influence its tendency and capacity to charge up (q=CV, remember?), so these will affect the vulnerability of the device to CDM ESD.

Packages with leads will also be more prone to CDM ESD than those without leads, since the leads provide an easier way for charged-up IC’s to discharge on a grounded surface. Packages with leads on corners and ends (or on all sides) are also more sensitive than packages with leads on its sides only, for the same reason.

IC’s that undergo manual assembly, test, and board mounting processes, on the other hand, may be more prone to HBM or MM ESD because of additional operator handling. On the other hand, IC’s that undergo fully automated processing that do a lot of sliding in tracks and feeders may be more vulnerable to CDM or MM ESD.

I would also imagine IC’s in metal cans to be less vulnerable to field-induced ESD.

Sorry, Assy Engr 2, but I have no empirical data at hand to back up my thoughts above.

EE

Joined: 20 Jun 2026 Posts: 76

Hi EE, Assy Engr 2,

It's quite well known that the capacitance of the package is a big factor in CDM ESD. In fact, the CDM ESD model takes into account Cpackage in the circuit. The value of Cpackage depends on the package being tested.
This value determines the amount of charge that the device can build up. Therefore it also determines the amount of energy that the device will dissipate if ESD occurs. There are loads of data on this in the internet if you want them.

FARel Engr