Sumitomo EMEXXXXU Molding Compound Problem

 
       SemiconFarEast.com Forum Index -> Assembly Forum
View previous topic :: View next topic  
Author Message
Neo Phyte



Joined: 20 Jun 2026
Posts: 4

PostPosted: Sat Jun 21, 2026 12:32 pm    Post subject: Sumitomo EMEXXXXU Molding Compound Problem Reply with quote

I came across something in Maxim's website about a problem with Sumitomo EMEXXXXU molding compounds. Anybody who knows what this is? I'm not so clear on what it is. Thank you.

Neo Phyte Cool


Back to top
View user's profile Send private message
FARel Engr



Joined: 20 Jun 2026
Posts: 43

PostPosted: Sat Jun 28, 2026 11:25 am    Post subject: Reply with quote

Hello Neo Phyte,

This pertains to leakage/shorts caused by metal bridges formed when P in the molding compound is transformed into acid by moisture. The acid dissolves the metal parts of the package and die. This frees up metal atoms that become mobile enough to form bridges under electrical bias.

FARel Engr

Here's a news clip I found on the internet:

Quote:
Phosphorus compound failure could affect millions of chips

Silver dendrite causes short circuits

By Mike Magee: Thursday 22 August 2002, 09:07

AN OBSCURE WARNING on a Web site has possible ramifications for the entire computer industry, it has emerged.

Maxim Integrated Products issued a warning at the beginning of this month to its own customers, "and to the industry", that phosphorus-based compound, added to chips around 1996, are now showing signs of potential degradation.

The warning claims that Sumitomo's EMExxxxU Series moulding compound included phosphorus particles "in response to popular political pressure" in an attempt to create a "more environmentally friendly material".

But that decision was made without knowing what impact the phosphorus particles would have on products.

And Maxim claims in the notice that the compound is now "associated with failures in products across the industry".

Apparently, a side effect of the compound is that silver dendrite grows between adjacent pins and causes high resistance short circuits between them.

It adds: "Millions of units were shipped by the industry containing the... molding compound before the problem was known".

The compound using phosphorus particles has been used in millions of ICs (integrated circuits) since 1996.

Sumitomo, it continues, claims there's no conclusive results that its compound is the cause of the failure.

However, it adds, circumstantial evidence suggests "there is a causal relationship".

Maxim said that it has demanded that its own assemblers stop using this compound in their own products.

Eek!


Back to top
View user's profile Send private message
Display posts from previous:   
       SemiconFarEast.com Forum Index -> Assembly Forum All times are GMT + 8 Hours
Page 1 of 1

 
Jump to:  
You can post new topics in this forum
You can reply to topics in this forum
You cannot edit your posts in this forum
You cannot delete your posts in this forum
You cannot vote in polls in this forum


Powered by phpBB 2.0.4 © 2001, 2002 phpBB Group
Theme created by Vjacheslav Trushkin