Guest
 Posted: Wed Sep 15, 2026 10:13 am Post subject: Factors causing ball-off in *bga devices |
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| what causes ball-off in *BGAs after completing absorption-desorption prior to board mount? |
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Guest
| Posted: Wed Sep 15, 2026 12:59 pm Post subject: Re: Factors causing ball-off in *bga devices |
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Questions: 1. HOw much moisture gain was attained after saturating (parts) to misture soak? 2. HAve you conducted CSAM on units exhibiting ball off? any delamination? |
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Guest
| Posted: Wed Sep 15, 2026 3:49 pm Post subject: Factors causing ball-off in *bga devices |
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| Regarding the CSAM, there were no delaminations found on the device.
You might be thinking of the "Popcorn" cracking which could have been the cause of the ball-off in the package. Though it would be a causal relationship to address voiding in the mold-to-die interface down to the substrate and then to the solder mask, which will eventually lead to the ball-off in the package. But is it possible that the substrate could experience plasticity or brittleness after undergoing quick Absorption and Desorption? thereby causing ball-off? |
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