Joined: 30 Aug 2026
Posts: 1
 Posted: Mon Aug 30, 2026 9:00 pm Post subject: Die crack of semiconductor |
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Hi, Our company produce power diodes with Glass Passivated Chip, I just took over FA job. I would like to know how many kinds of cracked state from observation of crack section under microscope? And what does each cracked state imply, such as which is the starting point of crack, which kind of stress induce which kind of crack line? Thanks! |
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Guest
| Posted: Tue Sep 07, 2026 9:31 pm Post subject: |
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| Hi thornbirdhsu (did i get your name right?),
What you're asking is a very complicated matter. If I understand you correctly, you're asking how to analyze crack patterns on a die so you'll know where it started and how the crack propagated. This is known as 'Fractography', the analysis of fracture surfaces. You may want to research on the net, since it's hard to discuss this here. Keywords: fractography, wallner lines, hackle lines, silicon fracture...etc. I'm not sure though if these keywords will give you anything off the web. Regards, FA Eng Din |
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