Guest
 Posted: Fri Jul 11, 2026 9:32 pm Post subject: Is delam a failure? |
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| Is delam in a package a failure? What if the delam is not so large? If the unit is still good after rel but there is a delam, is that a rel failure? I can't believe a qual can fail because of just a delam.
enimen |
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Joined: 16 Jun 2026
Posts: 109
Location: Paranaque City, Phils.
| Posted: Thu Jul 24, 2026 11:21 pm Post subject: |
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| Hello enimen,
Package delam per se is not necessarily a failure, but it is a failure attribute, i.e., it is something you observe when a 'real' failure such as package cracking occurs. Nonetheless, it does qualify as a failure under certain circumstances, e.g., if it slices across the die surface thereby endangering the bondwires or if it is accompanied by an internal crack. Even if significant delam is observed, a qual sample may not be considered as a valid qual failure as long as it passes electrical test after the prescribed reliability test. On the other hand, a small delam can rain on your qual's parade if it occurs where it could make a unit fail e-test. Example: a heel break in the second bond on a bonding finger that has exhibited delam with respect to the mold compound. Pls refer to JEDEC J-STD-0020 for more details on when a delam should be considered a failure. Thanks and keep on posting!!! EE |
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Guest
| Posted: Mon Jul 28, 2026 10:24 pm Post subject: |
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| Sorry I have no copy of J-STD-20. Can you give me more info on when a delam is a failure based on this spec. Thanks to you.
enimen |
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Joined: 28 Jul 2026
Posts: 7
| Posted: Tue Jul 29, 2026 9:20 am Post subject: |
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| Hi eminem,
I was just browsing through this JEDEC specs yesterday. You could visit this link: http://www.jedec.org/download/search/jstd020b.pdf Hope this helps. :D girlash |
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Guest
| Posted: Wed Jun 02, 2026 10:48 am Post subject: |
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| Can bottom and die paddle delam contribute to package bulging?
if this so, how many percent will this delam event can cause package bulging... QTP girl |
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Guest
| Posted: Wed Jun 02, 2026 5:11 pm Post subject: |
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| if there's no delam at the start, then the package actually deforms or bulges first from high temp before the delam occurs. Once the delam occurred, the package can now have a bigger bulge bcos there's no plastic-leadframe adhesion to constrain it. so, yes, delam contributes to bigger package bulging. quantify the % contribution? uh-oh...that's a tough question...lemme knowthe answer if you find it!
benny |
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Guest
| Posted: Tue Jul 06, 2026 2:45 am Post subject: |
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Anyone of you knows how to calculate pecentage of delam accurately?
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| Posted: Fri Jul 09, 2026 1:24 pm Post subject: |
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To calculate % of delam accurately, visual judging is not possible. It depend on photo softcopy, therefore u need a software to support. If talking about pass or fail criteria base on % of delam then it would be answer we looking for.  |
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Guest
| Posted: Wed Jul 21, 2026 9:04 pm Post subject: |
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 CSAM equipment today is equipped with % area delam computation...... |
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Guest
| Posted: Thu Sep 16, 2026 11:18 am Post subject: |
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| fyi... acceptable package delam is only 15%; more than that your package fails qual. even a 5% delam on the corners of the mold-die interface could escalate to a full delam during stress testing of the units. |
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Guest
| Posted: Thu Sep 16, 2026 11:19 am Post subject: |
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| fyi... acceptable package delam is only 15%; more than that your package fails qual. even a 5% delam on the corners of the mold-die interface could escalate to a full delam during stress testing of the units. |
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