Guest
 Posted: Tue May 25, 2026 4:43 am Post subject: Pre-conditioning |
 |
| Hi,
I'll be running a lead-free (pure Tin-lead frame plating) qual and not sure if I have to run pre-conditioning prior to the reliability stresses such as, THB, T/C and other long term stresses (ambient storage, temp humidity) for whisker study. What is the risk if I don't do pre-conditioning prior to these reliability stresses? Does anyone have any suggestions? Thanks, Guest |
|
Joined: 20 Jun 2026
Posts: 43
| Posted: Tue May 25, 2026 12:25 pm Post subject: |
|
| Hi Guest,
It is really very important for you to do precon prior to your major rel tests if you are qualifying a surface-mount package for a new Pb-free plating process. Precon simulates the board mounting of the customer at the high reflow temp of 260 C. Going directly to the rel tests will not reveal to you if your package will survive this high Pb-free board mounting temperature. My suggestion, therefore, is for you to include a precon before your rel tests. FARel Engr |
|
  |
Guest
| Posted: Thu Sep 16, 2026 11:23 am Post subject: |
|
| processing of quals include
VM, CSAM at t=0, precon, VM, CSAM, E-test |
|