Joined: 18 Mar 2026
Posts: 2
 Posted: Thu Mar 18, 2026 12:55 pm Post subject: Assembly failure ^_^ |
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| Hi, All
I am new QA engineer, in our company, we often encouter the die crack, ball lift and delamination in process. Can anybody share some researches on these defects? detail will be better. Thanks for your help. |
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Joined: 18 Mar 2026
Posts: 3
| Posted: Thu Mar 18, 2026 11:06 pm Post subject: |
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| poor quality in = poor quality out
what work is being done with die quality ? _________________ SATS Europe |
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Guest
| Posted: Fri Mar 19, 2026 12:20 am Post subject: |
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| Hi Forimprove,
The basic answers to your questions may be found here: http://www.semiconfareast.com/fmechs_pkg.html If you need more details, it's difficult to cover them all in this forum. I suggest you post a thread for each topic, and the topic should be specific. Rgds, AssyEngr3 |
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Joined: 18 Mar 2026
Posts: 2
| Posted: Fri Mar 19, 2026 10:56 am Post subject: |
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Thank you all for the help, yes, I wanna know more, d you mean I should post the topic one by one? |
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