Guest
 Posted: Mon Mar 08, 2026 3:53 pm Post subject: backside chipping |
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| what are the effects of backside chipping induced during wafer sawing |
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Joined: 20 Jun 2026
Posts: 43
| Posted: Tue Mar 09, 2026 12:18 am Post subject: |
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| Hi,
There's a danger that chip-outs induced by wafer saw are accompanied by microcracks that are difficult to detect. These microcracks can propagate upward to the active circuit if the device is exposed to thermomech stresses. In short, you must watch out for potential die cracking. If you're really in doubt, just do rel tests on some samples. FARel Engr |
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| Posted: Tue Mar 09, 2026 1:22 pm Post subject: |
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| how do they come up with criteria on the allowable size of chipping? |
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Guest
| Posted: Fri Oct 15, 2025 9:46 am Post subject: backside chipping |
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| I agree with FA engr, backside chipping is not normal and may propagate as side wall or top die cracks. Do check your sawing parameters especially the blade type/cut life and cut depth parameters. Are you doing dual pass cut?
I have a very nasty experience with this die crack at saw and I recommend you evaluate affected samples and have them pass through stress tests like IRR and/or TCT and check for propagation. BoAms |
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Guest
| Posted: Wed Oct 20, 2025 9:40 pm Post subject: |
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| what's the concept behind dual pass cutting? is there any industry standard on controls for back side chipping, like size, etc.? |
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