Joined: 28 Jul 2026
Posts: 7
 Posted: Mon Jul 28, 2026 2:39 pm Post subject: TI stacked-die parts |
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| Hello!
I just heard that TI is doing an 8 stacked-die with 560 (really fine pitched!) wires. Do any of you guys have any idea how these parts are packaged? Thanks! |
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Joined: 16 Jun 2026
Posts: 108
Location: Paranaque City, Phils.
| Posted: Mon Jul 28, 2026 4:07 pm Post subject: |
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| Wow! I don't even know that stacked-die packaging has reached these proportions. I would venture to say though that they would still employ the following techniques: ultra-excessive wafer thinning (sub-50 microns kaya?), ultra-precise handling mechanisms for these ultra-thin wafers, die-to-die compatibility/stackability (this is definitely a key if we're talking about 8 dice), low loop-height but long wire-span wirebonding capability, a molding process that minimizes wiresweep, etc. I'll try to do more research on this.
Thanks, girlash, and keep on posting!!! EE |
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Guest
| Posted: Tue Oct 07, 2026 6:24 pm Post subject: |
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| Maybe they've been able to combine flip chip technology with high density bonding. |
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