Joined: 27 Aug 2026
Posts: 3
 Posted: Fri Sep 12, 2026 10:27 am Post subject: Mold Compound Effect on Die-to-D/A Delamination |
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| Can the type of mold compound used have an effect on the die backside to die attach epoxy delamination for top molded packages?
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Joined: 28 Jul 2026
Posts: 7
| Posted: Fri Sep 12, 2026 10:51 am Post subject: |
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| Hello Alias,
We have experienced die to die backside delamination and one solution that is being looked into is a change in mold compound with lower cure temp requirement. From various evaluations, it was found out that exposure of our package to high temperature somehow degrades the die to the die attach epoxy interfacial adhesion. We have yet to look more into this. Maybe some of the guys here could enlighten us more? |
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Joined: 23 Jun 2026
Posts: 3
| Posted: Thu Oct 02, 2026 10:41 pm Post subject: |
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| Does anyone have an aswer or comment on this issue yet?
thx, memsy _________________ I you can't do it, don't! |
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| Posted: Sat Oct 04, 2026 6:57 pm Post subject: |
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memsy, galit ka ba? anyway, I have a one item to share, hope this could be useful to others. My lola is a dtfs engineer. She told me that mold compounds greatly influences the package robustness --- particular to package cracking. The story is quite long but in simplest sense, it is not in the mechanical process at dtfs alone that craks are produced. charing!!! ogag |
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Guest
| Posted: Thu Oct 09, 2026 7:01 pm Post subject: |
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based on my previous sexperiences, yes it will. In my own opinion, the CTE mismatch and the mod of E of the 2 materials must be considered. say for ex., it is best to have a combination between a high stress mold cpd and a low stress adhesive. Op kors, the adhesion strength of the adhesive to the die is also a factor for consideration.  |
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| Posted: Sat Oct 23, 2025 1:42 pm Post subject: |
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| Hi Guest,
Top molded packages are unique in the sense that the encapsulation to substrate interface is one sided which makes it critical to CTE mismatch between the materials used. The CTE of die attach material is usually the highest of them and this tend to push the substrate and the package apart. Additionally, the CTE mismatch between the substrate and the encapsulant exerts stress along their interface. Depending on the adhesion strength of the encapsulant, and the extent of CTE mismatch, encapsulant-to-substrate interface will soon delaminate and propagates under further stress. A delaminated encapsulant-to-substrate interface sets the substrate and the package to move in opposite direction and at that point the substrate-to-die attach and the die-to-die attach interfaces are the recipients of further stress. Depending on the adhesion strength holding this interfaces and the modulus of the D/A material, delamination develops and propagates on further stress. Yes, the encapsulant in a way has impact on delamination underneath the die. |
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