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 Posted: Wed Sep 17, 2026 11:04 am Post subject: What is Warpage Modeling? |
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| Im a new rel engr asked to get familiar with warpage modeling to understand how temp affects the internal stresses in the package per assembly step. Can you please explain to me what is warpage modeling?
Rgds, Klasmeyt |
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Joined: 16 Jun 2026
Posts: 108
Location: Paranaque City, Phils.
| Posted: Wed Sep 17, 2026 2:26 pm Post subject: |
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| When the IC is at a temperature where it has negligible internal stresses (temp at which it was molded or about 170C), it exhibits negligible warpage. Warpage (flexural deformation) occurs at temperatures higher or lower than this temp because of the differences in the CTE’s of the various parts and sections of the package.
In simplest form, assembly warpage modeling consists of measuring the maximum package warpage at each step of the assembly process, in relation to the temp at which the assy step occurred. This is the distance between the lowest and highest points on a surface of the package. Note that warpage has a direction (upward or downward bending). Get these warpage data, and you’ve basically performed warpage modeling. Modern warpage modeling techniques are FEA-based. Warpage modeling is used in analyzing package and joint stresses/reliability. EE |
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