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 Posted: Thu Sep 11, 2026 11:01 pm Post subject: Package with Highest Lead Count |
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| Which IC has the highest lead count today? What is its package?
Assy Engr 2 |
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Joined: 16 Jun 2026
Posts: 108
Location: Paranaque City, Phils.
| Posted: Fri Sep 12, 2026 10:51 am Post subject: |
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| Hi Assy Engr 2,
I don't know which particular IC has the highest lead count today, but there’s this new package called the Land Grid Array (LGA) which is said to be thinner, lighter, cheaper, ‘greener’, and of higher pin count than other packages. This package connects to the board or substrate through thin and flat lands that are more robust than balls. There is really a trend toward very high pin counts for LGA. The following is a list of existing LGA’s with I/O counts of more than 600: LGA 0.8mm, LGA 1.0mm, IBM OLGA P4, Sun ceramic LGA SPARC III and Sun SPARC IV and V. I also read somewhere that 60 percent of LGA’s will have pin counts of over 1000 pins (average = 2,820 pins) by 2006. EE |
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