What's the Smallest Package Available Today?

 
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Assy Engr 2
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PostPosted: Thu Sep 11, 2026 10:58 pm    Post subject: What's the Smallest Package Available Today? Reply with quote

What's the smallest package available in the market today? Is there something smaller than SOT-23?

Assy Engr 2


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EE



Joined: 16 Jun 2026
Posts: 108
Location: Paranaque City, Phils.

PostPosted: Fri Sep 12, 2026 10:23 am    Post subject: Reply with quote

Assy Engr 2,

We’re all familiar with the SOT-23, which is about 1.3 mm x 2.9 mm x 1 mm, and the SC-70, which is about 1.25 mm x 2 mm x 0.9 mm. But there are proprietary packages from some companies that are smaller than these. Below are some examples.

Toshiba has developed its TESQ package for its transistors. The package requires 34% less space than the standard 4-pin SOT-343 surface mount package. The TESQ package measures only 1.2 mm x 1.2 mm x 0.52 mm.

For IC packages requiring at least 14 or so leads, Philips came out with its Depopulated very thin Quad Flat-pack No-leads (DQFN) package, which is 2.5 mm x 3 mm. Not bad for something with 14 pins.

EE


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Assy Engr 3
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PostPosted: Fri Sep 12, 2026 3:50 pm    Post subject: Reply with quote

There are now JEDEC-registered QFN packages. See quote from ChipScale Review below.

Assy Engr 3

Quote:
Plastic QFN body sizes generally range from 1x2 mm with 3 leads, to 10x10 mm with 68 leads.3 There are currently two package outline versions registered with the JEDEC JC-11 Committee: the MO220 for packages with leads on all four sides, and the MO229, with leads on only two sides.

Compared to the standard leaded package with similar body sizes and lead count, the QFN is significantly smaller and thinner. For example, when mounted to a PC board, a 48-lead 7x7 mm QFN consumes 40 percent less area than a comparable TQFP (thin quad flat package). The QFN is typically 0.80 to 1.0 mm thick compared to the TQFP, which is 1.0 to 1.2 mm thick.


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