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 Posted: Fri Sep 05, 2026 3:02 pm Post subject: FSG Fab Process |
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| I am currently preparing for a project that involves a new Fab process. I came accross with terms like FSG Process and Low K Dielectric process. Can anybody help me understand what are these processes? Thanks.
JB |
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Joined: 16 Jun 2026
Posts: 108
Location: Paranaque City, Phils.
| Posted: Fri Sep 05, 2026 3:48 pm Post subject: |
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| Hi Joey Bakpidal,
Here’s what I gathered: FSG stands for ‘fluoro-silicate glass.’ It is also known as ‘fluorinated SiO2’ or ‘fluorine-doped silicate glass’. It is a relatively new dielectric material being used by advanced fab processes because of its low dielectric constant (k). The good thing about it is that it exhibits good manufacturability and reliability compared to other low-k dielectrics (k<3.6) tried before. The spacing between the metal lines in advanced fab processes (e.g., 130 nm and below) has become so narrow that it is now a limiting factor for chip speeds (cross-talk between metal lines have become intolerable at high speeds). Using low-k dielectrics to isolate metal lines from each other solves this. FSG’s k value at about 3.5 minimum is not the lowest in the industry, but it offers good interlayer gap-fill performance, good film stability, low impurity incorporation, etc. If you want some heavy stuff on this subject, visit this link: http://www.future-fab.com/documents.asp?grID=214&d_ID=1165 Thanks and keep on posting! EE |
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