FARel Engr
Joined: 20 Jun 2026 Posts: 43
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Posted: Sat Jun 28, 2026 11:25 am Post subject: |
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Hello Neo Phyte,
This pertains to leakage/shorts caused by metal bridges formed when P in the molding compound is transformed into acid by moisture. The acid dissolves the metal parts of the package and die. This frees up metal atoms that become mobile enough to form bridges under electrical bias.
FARel Engr
Here's a news clip I found on the internet:
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Phosphorus compound failure could affect millions of chips
Silver dendrite causes short circuits
By Mike Magee: Thursday 22 August 2002, 09:07
AN OBSCURE WARNING on a Web site has possible ramifications for the entire computer industry, it has emerged.
Maxim Integrated Products issued a warning at the beginning of this month to its own customers, "and to the industry", that phosphorus-based compound, added to chips around 1996, are now showing signs of potential degradation.
The warning claims that Sumitomo's EMExxxxU Series moulding compound included phosphorus particles "in response to popular political pressure" in an attempt to create a "more environmentally friendly material".
But that decision was made without knowing what impact the phosphorus particles would have on products.
And Maxim claims in the notice that the compound is now "associated with failures in products across the industry".
Apparently, a side effect of the compound is that silver dendrite grows between adjacent pins and causes high resistance short circuits between them.
It adds: "Millions of units were shipped by the industry containing the... molding compound before the problem was known".
The compound using phosphorus particles has been used in millions of ICs (integrated circuits) since 1996.
Sumitomo, it continues, claims there's no conclusive results that its compound is the cause of the failure.
However, it adds, circumstantial evidence suggests "there is a causal relationship".
Maxim said that it has demanded that its own assemblers stop using this compound in their own products.
Eek! |
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