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No new posts Die Backside Cracks
 1 Virgo 70 Tue Dec 07, 2025 10:25 pm
Passerby
No new posts FPC Blanking ---- Applicable to Semicon?
 6 batman 508 Fri Nov 19, 2025 12:25 pm
asem
No new posts Die lifting and cleaning
 0 yoveli 55 Tue Nov 16, 2025 10:20 pm
yoveli
No new posts Burr removal
 0 Dumbfounded 69 Sun Nov 07, 2025 10:53 pm
Dumbfounded
No new posts Mold Compound Effect on Die-to-D/A Delamination
 5 Alias 634 Sat Oct 23, 2025 1:42 pm
Guest
No new posts Assembly Foundries
 3 SATS 546 Wed Oct 06, 2026 11:14 pm
EE
No new posts Org for Subcon Management in the Phils
 0 akd 132 Mon Sep 20, 2026 11:58 am
akd
No new posts Eutectic Temperature for various die back metallizations
 3 IkingJr 487 Sat Sep 18, 2026 1:23 am
newman
No new posts What is purple plague?
 0 MJ88 141 Fri Aug 20, 2026 11:15 am
MJ88
No new posts Copper Wirebonding
 1 IkingJr 386 Fri Jun 11, 2026 9:08 pm
EE
No new posts Compound on Lead Problem
 3 Admin 558 Thu May 27, 2026 5:49 pm
Guest
No new posts Bond Line Void
 1 Guest 420 Fri Mar 19, 2026 12:26 pm
Guest
No new posts Assembly failure ^_^
 3 Forimprove 571 Fri Mar 19, 2026 10:56 am
Forimprove
No new posts Au-Si eutectic bonding
 2 Curious 485 Wed Jan 28, 2026 12:51 pm
curious
No new posts Aluminum Wire for PBGA Interposer?
 0 SZMANIA 367 Mon Jan 05, 2026 8:55 pm
SZMANIA
No new posts Hitachi CEL 9220HF13
 2 Moldtech 507 Wed Dec 10, 2025 1:19 pm
Doppler
No new posts IMC crack at time zero.....(T_T)
 4 nurung73 555 Fri Nov 28, 2025 2:24 pm
FARel Engr
No new posts Missing Die Overcoat
 4 Resident Engr 477 Fri Nov 21, 2025 2:04 pm
Resident Engr
No new posts Versatility
 3 guest 498 Thu Nov 13, 2025 5:44 pm
rock rockan
No new posts Molecular Sieves
 2 Lukring 379 Fri Nov 07, 2025 11:23 am
jackpot
No new posts TI stacked-die parts
 2 girlash 431 Tue Oct 07, 2026 6:24 pm
tropang kulit
No new posts Die Crack
 2 ogag 474 Mon Oct 06, 2026 3:44 pm
FARel Engr
No new posts Neck Break Issue
 1 Assy FA Engr 359 Thu Oct 02, 2026 5:46 pm
Golden Boy
No new posts What is Warpage Modeling?
 1 Klasmeyt 347 Wed Sep 17, 2026 2:26 pm
EE
No new posts Die To Epoxy Adhesion
 2 Alias 440 Tue Sep 16, 2026 11:33 pm
Assy Engr 2
No new posts What's the Smallest Package Available Today?
 2 Assy Engr 2 394 Fri Sep 12, 2026 3:50 pm
Assy Engr 3
No new posts Package with Highest Lead Count
 1 Assy Engr 2 340 Fri Sep 12, 2026 10:51 am
EE
No new posts Tin Whiskers and Pb-free Assembly
 4 Supergirl 507 Tue Sep 09, 2026 1:50 pm
FARel Engr
No new posts FSG Fab Process
 1 Joey Bakpidal 328 Fri Sep 05, 2026 3:48 pm
EE
No new posts CTE's of the Parts of a Plastic Package
 1 Plastic Engr 343 Fri Sep 05, 2026 2:57 pm
EE
No new posts Sony Green Partner Program
 2 budatan 423 Thu Sep 04, 2026 2:00 pm
FARel Engr
No new posts What is soldy testing?
 2 budatan 431 Thu Sep 04, 2026 11:40 am
budatan
No new posts Fault Tree Analysis
 3 Joey Bakpidal 457 Wed Sep 03, 2026 1:31 pm
Joey Bakpidal
No new posts What is "Swiss Cheese"?
 2 Alias 423 Fri Aug 29, 2026 10:27 am
believe me or not
No new posts What are Die Vias?
 1 girlash 372 Thu Aug 28, 2026 10:21 am
EE
No new posts Anyone familiar with SOL?
 2 Chick Boy 388 Wed Aug 20, 2026 9:00 am
EE
No new posts Contam on Bond Pad
 4 Seinfeld 500 Fri Aug 01, 2026 11:03 am
FARel Engr
No new posts Link to Pb-free Activities
 2 Neo Phyte 465 Tue Jul 08, 2026 11:23 am
EE
No new posts Sumitomo EMEXXXXU Molding Compound Problem
 1 Neo Phyte 438 Sat Jun 28, 2026 11:25 am
FARel Engr
No new posts Critical Criteria for Bond Wire Selection
 1 Admin 401 Sun Jun 22, 2026 11:22 pm
Admin
No new posts Solder Whiskers
 1 Admin 423 Sun Jun 22, 2026 11:16 pm
Admin
No new posts Popcorn Cracking
 1 Admin 426 Sun Jun 22, 2026 11:07 pm
Admin
No new posts Resolving Ball Lifting Issues
 1 Admin 413 Sun Jun 22, 2026 11:03 pm
Admin
No new posts Welcome to the Assembly Forum!
 0 Admin 306 Mon Jun 16, 2026 9:12 pm
Admin
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