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Scanning
acoustic microscopy has several modes. The
A-scan mode is the real-time
oscilloscope waveform of the acoustic signals based on the reflected
echoes, or acoustic data collected at a single X-Y portion or point.
The
B-scan mode
is the cross-sectional display showing the
ultrasonic reflection of the various interfaces along the depth of the
package, or acoustic data collected along the X-Z plane at depth A.
A B-mode scan furnishes a two-dimensional (cross-sectional)
description along a test line (Y).
The
C-scan mode is the display of the
image of reflected echoes at the focused plane of interest, or
acoustical data collected along an X-Y plane at depth Z. A C-mode scan
furnishes a two-dimensional (area) description at a particular depth
(Z) (see Figure 2). Usually the B-scan images are based on the C-scan image for precise
determination of the depth of flaws detected.

Figure 2.
Examples of C-SAM Photos;
red areas
denote full delamination while yellow
areas denote
slight delamination
When
performing Scanning Acoustic Microscopy, the following must be observed
:
1)
The units must be placed in the sample holder such that their upper
surfaces are parallel to the scanning plane of the acoustic transducer.
Air bubbles must be swept away from the unit surfaces and from the
bottom of the transducer head.
2)
The transducer with the highest center frequency that still provides
sufficient signal-to-noise ratio for good imaging must be selected. The
transducer must be normal to the plane of the sample and the scan path
must be parallel to the plane of the stage.
Failure
Mechanisms/Attributes Tested For:
Plastic-to-Leadframe Delamination, Plastic-to-Die Delamination,
Plastic-to-Die Attach Delamination, Die Attach Voids, Internal Cracks,
etc.
Internal delaminations generally need to be addressed (especially those
that occur on the die surface and bonding fingers) because they can lead
to serious reliability issues such as neck breaks, heel breaks, and
corrosion.
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