|
Die Attach
Materials - Page 2 of 3: Die Attach Alloys
Table
1. Properties of Some Die Attach Alloys from
Semiconductor
Packaging
Materials
(SPM)
|
Alloy |
Melting Temp.(oC) |
Application |
Advantages/Disadvantages |
|
80Au-20Sn |
280 |
Die
attachment; Chip packaging. |
High thermal conductivity and
creep resistance/
expensive. |
|
88Au-12Ge |
356 |
Die
attachment; Chip packaging. |
High thermal conductivity and
creep resistance/
expensive. |
|
97Au-3Si |
370 |
Die
attachment; Chip packaging. |
High thermal conductivity and
creep resistance/
expensive. |
|
97.5Pb-1Sn-1.5Ag |
309 |
Die
attachment; Chip packaging. |
It is a eutectic alloy having
fast heat response/
contains Pb. |
|
63Sn-37Pb |
183 |
Die
attachment; Chip and board packaging. |
The most widely used in PCB
packaging having fast heat response and high wetting power;
reliability well established/
contains Pb. |
|
62Sn-36Pb-2Ag |
179 |
Die
attachment; Chip and board packaging. |
Widely used in PCB packaging
having fast heat response and high wetting power and compatible
with Ag metallization/
contains Pb. |
|
97.3Bi-2.5Ag-0.2Cu |
260 |
Die
attachment. |
High temperature packaging
ability and low cost/ no
reliability study. |
|
96.5Sn-3.5Ag |
221 |
Die
attachment; Chip and board packaging. |
Widely targeted as a PCB
packaging solder and reliability well established /
melting temperature
still relatively high. |
|
99.3Sn-0.7Cu |
227 |
Die
attachment; Chip and board packaging. |
Widely targeted as a PCB wave
soldering solder and reliability well established
/
melting temperature
still relatively high. |
|
94.7Sn-3.3Ag-2Cu |
217 |
Die
attachment; Chip and board packaging. |
The most widely targeted as a
PCB packaging solder and very stable eutectic point/
melting temperature
still relatively high. |
|
58Bi-42Sn |
138 |
Temperature sensitive device packaging. |
Targeted as low cost PCB
packaging solder and reliability well established /
plasticity
still relatively low. |
|
52In-48Sn |
118 |
Temperature sensitive device packaging. |
Will absorb package thermal
strain due to its low strength and high ductility/ expensive. |
Table
2. Properties of Some Die Attach Alloys from Loctite
|
Product |
Application |
Resin/
Filler |
Viscosity
5
rpm/
25C (cps) |
Thixo.
Index
.5/5
rpm |
Thermal
Cond'vity
(W/m
K) |
Mod
of Elasticity
(GPa)
|
Oven
Cure (15 min @)
|
|
QMI506 |
BGA,
CSP |
BMI/Silver |
8500 |
4.9 |
1.1 |
0.35 |
150C |
|
QMI516 |
BGA,
CSP |
BMI/Silver |
8000 |
3.0 |
3.0 |
0.8 |
150C |
|
QMI526 |
BGA,
CSP, Cavity-down BGA |
BMI/Silver |
9000 |
5.8 |
2.5 |
2.5 |
150C |
|
QMI527 |
BGA,
CSP |
BMI/Silver |
6800 |
5.5 |
2.6 |
2.6 |
150C |
|
QMI536 |
Stacked
CSP |
BMI/Teflon |
9000 |
5.5 |
0.2 |
0.2 |
150C |
|
QMI536HT |
Lid
Attach, PBGA |
BMI/B-N |
13000 |
5.5 |
0.76 |
0.76 |
150C |
|
QMI546 |
Stacked
CSP |
BMI/Teflon |
7500 |
5.5 |
0.28 |
0.28 |
150C |
|
QMI547 |
Stacked
CSP |
BMI/Teflon |
6500 |
5.5 |
0.8 |
0.8 |
150C |
|
QMI505MT |
Leadframes |
BMI/Silver |
12000 |
4.3 |
2.4 |
0.92 |
150C |
|
QMI518 |
Cavity-down
BGA
|
BMI/Silver
|
8500
|
4.7
|
1.4
|
300
|
180C
|
|
QMI519 |
Pre-plated
Leadframes
|
BMI/Silver
|
9000
|
4.2
|
2.61
|
850
|
180C
|
|
QMI534 |
Various
Substrates
|
BMI/Teflon
|
9000
|
5
|
0.4
|
850
|
150C
|
|
KO111
|
Conventional
|
Epoxy/Silver
|
7500
|
4.9
|
3.7
|
850
|
10m@165C
|
|
KO125
|
Conventional
|
Epoxy/Silver
|
52000
|
5.8
|
2.1
|
_
|
10m@165C
|
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