 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Metallizations Used in Semiconductor Manufacturing
Semiconductor devices employ metallizations primarily to serve as a means of electrical contact and interconnection within the die circuits. Thin-film aluminum is the most widely used metallization in semiconductor manufacturing because of its many desirable properties, but there are many other metals or alloys used for the same purpose. Table 1 shows examples of such metals and alloys along with some of their properties.
The last column of Table 1 pertains to the critical temperature beyond which the metallization on silicon becomes unstable in one of several ways: further reaction with silicon, decomposition, agglomeration, or mechanical failure. These temperatures were determined either by experimentation or experience within the industry.
Table 1. Properties of Metallizations Used in Integrated Circuits
Reference: Sze, "VLSI Technology", McGraw Hill
Buy it now
from Amazon.com:
VLSI technology (McGraw-Hill series in electrical engineering)
LINKS: Metallization; Thin Films; Ohmic Contacts
Copyright © 2005 www.SiliconFarEast.com. All Rights Reserved. |
